Thermal stress simulation vs die lifetime

This study was presented by FORM at the Flow3d European User Meeting in Vienna June 2014. We’ve tested the new capabilities of the new stress and strain module of Flow-3d by analysing the evolution of stresses into the steel of the die during the warm-up stage. The goal of this study was to evaluate the influence of thermoregulation circuits in the die lifetime. This study was later developed by our partner XC engineering

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